BASE MATERIAL (LAMINATE)
Product
/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Base Material
(Laminate)
FR1/FR2
FR4
CEM-1
CEM-3
TEFLON / DUROID
CERAMIC
/ TMM
Copper Thickness
½ OZ (17,5 µ)
1 OZ (35 µ)
2 OZ (70 µ)
3 OZ (105 µ)
DRILLING
ELECTROLESS COPPER PLATING
DRY-FILM LAMINATION
DRY-FILM EXPOSURE
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Phototool Thickness
7mils
DRY-FILM DEVELOPMENT AND COPPER ELECTROPLATING
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Hole Copper Plating Thickness
(minimum average)
1 mil (25 µ)
TIN RESIST ELECTROPLATING
DRY-FILM STRIPPING
COPPER ETCHING
TIN RESIST STRIPPING
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Minimum Trace Width And Spacing
4 Mils (0,10 mm)
LIQUID PHOTOIMAGEABLE (LPI)
SOLDER MASK COATING
LPI SOLDER MASK EXPOSURE
LPI SOLDER MASK DEVELOPMENT
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Liquid Photoimageable Solder Mask
Green
Black
Red
Blue
Yellow
Clear
Temporary Mask
Solder Out (peelable)
SURFACE
FINISHING
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Surface Finishing
HASL (Sn/Pb)
HASL Lead Free
Carbon
Electroplated Nickel
Electroless Nickel Immersion Gold
Electroplated Gold
Minimum Hole Diameter
(After Plating)
8 mils (0,20 mm)
LEGEND
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Legend
White
Yellow
Black
MECHANICAL FINISHING
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Mechanical Finishing
Routing
V-scoring
Tab Routing
Largest PCB
16.5" x 22.5" (420 x 570 mm)
ELECTRICAL TEST
Product/process
Capability/Feature
Single
Sided
Double
Sided
Multilayer
Electrical Test
Test Voltage
75 to 250 VDC
Insulation/Short
1 MOhm to 100 MOhm
Continuity/Open
1 Ohm to 30 kOhm
Resistance Measurement
5 Ohm to 30 kOhm
Minimum Test Area
(Pad)
3 mils (76 µm)
Minimum Point to Point Distance
(center/center)
6 mils (150 µm)
